Innovative chip package and small footprint is ideal for small mobile applications Sunnyvale, Calif., March 8, 2004 — Oki Semiconductor, a leading technology partner for the new era of digital ...
SUNNYVALE, Calif.--(BUSINESS WIRE)-- Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of power discretes, ICs, modules, and ...
Fujitsu is sampling a 1Mbit SPI FRAM in an 8-pin WL-CSP device measuring 3.09×2.28×0.33mm which reduces the surface mounting area by 77%, and the device height by 80% compared to an S0P-8 package. The ...
The semiconductor is a highly integrated device that cannot be connected directly to the main board in the way that condensers or resistors can. Therefore, a packaging substrate (or intermediary layer ...
A fully qualified, high-performance, low-power and small-form-factor wafer-level chip-scale package (W-CSP) developed by Oki Semiconductor satisfies a wide range of ASIC design demands. Targeting chip ...
CSP, driven by end-customer demand for portable handheld products, is exploding in use across the IC packaging industry. But the most utilized CSP package style emerging for 8-64 lead-count devices is ...
Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and Amkor Technology will continue to commit heavy investments for ramping their high-end backend service capacities ...
SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, announced today that it has introduced “Fx-CSP,” a line-up of LED packages which ...
IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...
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