Innovative chip package and small footprint is ideal for small mobile applications Sunnyvale, Calif., March 8, 2004 — Oki Semiconductor, a leading technology partner for the new era of digital ...

ST Assembly Test Services (STATS) today unveiled an IC package for wired and wireless communications devices. The Singapore-based company said the stacked die ball grid array (SDBGA) combines a number ...

Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some ...

Eagan, Minn. — Ironwood Electronics' new high performance sockets, the SG-BGA-7023 and SG-BGA-7025, allow 0.5-mm and 0.65-mm pitch BGA devices ICs to be used in socket in high-speed computing and ...

Much has changed in IC packaging technology since the first real-time microfocus X-ray systems entered the inspection market nearly 20 years ago. The trend for high-density packaging is moving from ...